Global Bonding Wires Market growing at a CAGR of 3.1% from 2023 to 2030
Category : Machinery and Equipment | Published Date : Jun 2023
Key Market Overview
The global bonding wires market was valued at USD 12,730.27 million in 2022 and is expected to register a compound annual growth rate of 3.1% to reach USD 16,072.24 million in 2030.
The report highlights the increasing demand for bonding wires for establishing connections between semiconductor devices in consumer electronics, automotive parts, and others. Consegic Business Intelligence provides an inclusive research report on the bonding wires market that evaluates multiple factors, such as market size, value, supply chain, regulatory environment, and trends.
Global Bonding Wires Market By Overview
The report analyses significant segments such as type, bonding process type, wire thickness, material, application, end-user and region, to identify emerging trends and potential opportunities. The end-user segment is expected to grow due to the increasing adoption of miniaturized and IoT-enabled devices among consumers. Moreover, the increasing demand for bonding wires in automotive industry to support advanced functionalities and features such as ADAS systems, sensors, and others is accelerating the growth of the market.
Get Free SampleMarket Dynamics
Driver:
- The increasing demand for bonding wires in connecting electronic components in consumer electronics devices is driving the growth of the market.
- The application of binding wires in automotive industry for safety, connectivity, and ADAS features is accelerating the growth of bonding wires market.
- The growing adoption of bonding wires in medical devices is propelling the growth of the market.
Restraints:
- The presence of alternate technology including laser welding machines is hindering the growth of the market.
- The limited current carrying capacity of bonding wires is restraining the growth of the market.
Market Segmentation:
| Report Attributes | Report Details |
| By Type | Ball Bonders, Wedge Bonders, Stud/Bump Bonders, and Peg Bonders |
| By Bonding Process Type | Thermo-compression Bonding, Thermosonic Bonding, and Ultrasonic Bonding |
| By Wire Thickness | 0μm-75μm, 75μm-150μm, 150μm-300μm, and 300μm-500μm |
| By Material | Copper, Aluminum, Gold, Silver, and Palladium-coated Copper (PCC) |
| By Application | MEMS, Memory, Sensors, Optoelectronics System, and Others |
| By End-User | Automotive, Aerospace & Defense, Consumer Electronics, Telecommunications, Healthcare, and Others |
| By Region | North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa |
Competitive Landscape :
The global bonding wires market is highly competitive due to the presence of major players such Cirexx International Inc., Powertech Technology Inc., Alter Technology, QP Technologies, Amkor Technology Inc., NEOTech Inc., JCET Group Co. Ltd. operating in the global market. The market players are adopting new ways through product innovations, mergers and acquisitions, and business strategies to remain hold strong market position. Thus, evolving research and developments in bonding wires market are expected to help market players adopt innovative ways of product creation to cater to the growing needs of various industries.
- Cirexx International Inc.
- Powertech Technology Inc.
- Alter Technology
- QP Technologies
- Amkor Technology Inc.
- NEOTech Inc.
- JCET Group Co. Ltd.
- ASE Technology Holding Co. Ltd.
- Tektronix Inc.
