Global Wire Bonder Equipment Market growing at a CAGR of 9.8% from 2023 to 2030
Category : Machinery and Equipment | Published Date : May 2023
Key Market Overview
The wire bonder equipment market is poised for strong expansion and is projected to reach USD 1,624.70 Million by 2030. The market was sized at USD 786.14 Million in 2022 and is predicted to grow at a compound annual growth rate of 9.8% during the period 2023-2030.
The report highlights the increasing adoption of wire bonder equipment owing to the advancements in technology including automation to enhance productivity and reduce the programming time. Consegic Business Intelligence provides an inclusive research report on the wire bonder equipment market that evaluates multiple factors, such as market size, value, supply chain, regulatory environment, and trends.
Global Wire Bonder Equipment Market By Overview
The report analyses significant segments such as type, product, material, end-user, and region, to identify emerging trends and potential opportunities. The automatic wire bonder segment is expected to grow during the forecast period owing to the advancements in technology including motion control technology that offers optimum bond quality, ease of use, and reliability. In addition, the emergence of new software that facilitates the process of transferring and maintaining programs across multiple systems is expected to increase the adoption of automatic wire bonders in automotive assemblies.
Get Free SampleMarket Dynamics
Driver:
- Development of advanced technology including automation serves as a key factor for driving the growth of the wire bonder equipment market.
- Increasing investments by key companies in research and development is propelling the market growth.
- The increasing adoption of wire bonder equipment in industries namely automotive and manufacturing for process development is contributing significantly in accelerating the market growth.
Restraints:
- Resonance created by ultrasonic energy serves as a major restraint for the growth of the market.
- Contamination at the bonding interface affects the bond integrity and restraints the growth of the wire bonder equipment market.
Market Segmentation:
| Report Attributes | Report Details |
| By Type | Manual, Semi-Automatic, and Automatic |
| By Product | Ball Bonder, Wedge Bonder, Stud-Bump Bonder, Ultrasonic Bonder, Thermocompression Bonder, and Thermosonic Bonder |
| By Material | Gold Wire, Copper Wire, Aluminum Wire, and Silver Wire |
| By End-User | Outsourced Semiconductor Assembly and Testing (OSAT) and Integrated Device Manufacturers (IDM) |
| By Region | North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa |
Competitive Landscape :
The landscape for wire bonder equipment market is highly competitive with major players including Palomar Technologies, Amkor Technology, Inc., ASM Pacific Technology, and BE Semiconductor Industries N.V. that have a strong market position in current market circumstances. Further, the wire bonder equipment market is expected to witness significant growth in coming years owing to the increasing adoption of wire bonders particularly automatic wire bonders for the process development and production of microelectronic devices. The market players compete for a firm market position through mergers and acquisitions, product innovations, and business strategies. Thus, evolving research and developments in the wire bonder equipment market are expected to help market players adopt innovative ways of product creation to cater to the growing needs of various end-use industries.
- Palomar Technologies
- Amkor Technology Inc.
- ASM Pacific Technology
- BE Semiconductor Industries N.V.
- DIAS Automation (HK) Ltd.
- F & S BONDTEC Semiconductor GmbH
- F&K Delvotec Bondetechnik
- Hesse GmBH
- Promex Industries Inc.
- Q&P Technologies LLC