Global Interposer Market growing at a CAGR of 19.7% from 2023 to 2030
Category : Semiconductor And Electronics | Published Date : Jun 2023
Key Market Overview
The interposer market is poised for strong expansion and is projected to reach USD 1,334.25 Million by 2030. The market was sized at USD 322.04 Million in 2022 and is predicted to grow at a compound annual growth rate of 19.7% during the period 2023-2030.
The report highlights the increasing adoption of interposers in consumer electronics devices to offer miniaturization and high data transfer rates. Consegic Business Intelligence provides an inclusive research report on the interposer market that evaluates multiple factors, such as market size, value, supply chain, regulatory environment, and trends.
Global Interposer Market By Overview
The report analyses significant segments such as product type, application, end-user, and region, to identify emerging trends and potential opportunities. The ASIC/FPGA (Application-Specific Integrated Circuit/Field-Programmable Gate Array) segment is expected to register the fastest CAGR during the forecast period. ASICs and FPGAs are extensively employed in high-performance computing applications including data centers, artificial intelligence, machine learning, and scientific research. The applications require advanced processing capabilities, high-speed data transfer, and efficient power management capabilities. Interposers enable the integration of ASICs and FPGAs with other components, optimizing the performance and enabling higher computational efficiency.
Get Free SampleMarket Dynamics
Driver:
- Rising demand of interposers in wearable devices to offer high-speed data transfer is driving the market growth.
- Increasing demand for miniaturization in electronic devices including smartphones and tablets is propelling the growth of the market
- The ability of interposers to reduce interconnect lengths resulting in improved system performance, reduced power consumption, and enhanced functionality is driving the growth of the market.
Restraints:
- The high cost of production of interposers is the key factor responsible for hampering the growth of the market.
- Presence of alternatives including wire bonding offering miniaturization in electronic devices is hampering the market growth.
Market Segmentation:
| Report Attributes | Report Details |
| By Type | 2D Interposer, 2.5D Interposer, and 3D Interposer |
| By Application | ASIC/FPGA, CIS, CPU/GPU, Logic SoC, MEMS 3D Capping Interposer, RF Devices, and Others |
| By End User | Telecommunication, Consumer Electronics, Automotive, Military & Aerospace, and Others |
| By Region | North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa |
Competitive Landscape :
The landscape for interposer market is highly competitive with major players including Black Box Limited, ALLVIA Inc., Amkor Technology, Inc., and Murata Manufacturing Co., Ltd. that have a strong market position in current market circumstances. Further, the interposer market is expected to witness significant growth in coming years owing to the increasing adoption of interposers in consumer electronics devices to offer miniaturization and high data transfer rates. The market players compete for a firm market position through mergers and acquisitions, product innovations, and business strategies. Thus, evolving research and developments in the interposer market are expected to help market players adopt innovative ways of product creation to cater to the growing needs of various end-use industries.
- Black Box Limited
- ALLVIA Inc.
- Amkor Technology, Inc.
- Murata Manufacturing Co., Ltd.
- Plan Optik AG.
- TEZZARON
- Taiwan Semiconductor Manufacturing Company Limited
- Xilinx, Inc.
- NHanced Semiconductors Inc.
- DuPont
- Teledyne Technologies Incorporated