Electronic Packaging Market - Size, Share, Industry Trends, and Forecasts (2025 - 2032)

By Material Type:

Based on the material type, the market is segmented into plastic, glass, metal, and ceramics.

Plastic is one of the primary materials used in electronics packaging, attributing to its several benefits including lightweight, superior electrical insulation, and cost-efficiency among others. Moreover, metals are often used in electronic enclosures due to its properties such as high strength, durability, and electromagnetic shielding among others. Additionally, ceramics offer excellent electrical insulation, high thermal resistance and stability, and chemical resistance, which makes it ideal for use in electronics packaging application.

Trends in the Material Type:

• The trend toward reusability and recyclability of plastic materials is driving the market progress.
• The trend towards adoption of metal packaging in 5G and high-power semiconductors is driving the market evolution.

Plastic accounted for the largest revenue share of 46.20% in the year 2024.

The properties of plastics such as lightweight, cost-effectiveness, and excellent insulation are driving the adoption for packaging of electronic devices or components. Further, the increasing focus towards sustainability is driving the adoption of biodegradable and recyclable plastic materials, which in turn is boosting the market development. Furthermore, the versatility of plastic material for packaging electronic devices or components is paving the way for market progress. Moreover, the rising need for smaller, portable electronic devices is propelling the adoption of highly durable plastic material for packaging.

Thus, as per the market analysis, increasing focus towards sustainability is driving the adoption of recyclable plastic material for packaging of electronics.

Ceramics is anticipated to register the fastest CAGR during the forecast period.

The biocompatibility and ability to withstand sterilization processes is driving the adoption of ceramic for packaging. Additionally, ceramic helps protect sensitive components such as pacemakers and drug delivery systems. Further, the rising adoption of ceramic packaging in healthcare sectors for medical implants and others is paving the way for market progress.

Therefore, according to the electronic packaging market analysis, the rising adoption in healthcare sector is anticipated to boost the market during the forecast period.

By Packaging Type:

Based on the packaging type, the market is segmented into surface mount packaging, through-hole packaging, and hybrid packaging.

In surface mount technology, electronic components are mounted directly onto the surface of printed circuit boards (PCBs). Surface mount technology is designed to occupy less physical space, facilitating the development of compact electronics devices. Meanwhile, through-hole packaging involves electronic components with leads that are inserted through holes in a PCB and soldered on the opposite side. Additionally, hybrid packaging combines various types of packaging technologies within a single assembly, integrating both surface mount and through-hole components. Hybrid packaging is often used in more complex circuits requiring a combination of different component types.

Trends in the Packaging Type:

• The trend towards need for packaging solution which meets the requirements of modern electronic devices such as smartphones, tablets, and wearables is boosting the surface mount packaging segment.
• The growing number of connected devices, IoT applications, and industrial automation initiatives is driving the adoption of through-hole packaging which in turn is fueling the electronic packaging market trends.

Surface Mount Packaging accounted for the largest revenue share in the year 2024.

The rising adoption of compact and lightweight electronic devices is propelling the need for improved performance and ease of assembly for packaging. Additionally, the surface mount type packaging supports high-speed manufacturing processes which are ideal for growing consumer electronics sector and automotive sectors. Further, the rising focus towards thermal management and reliability in surface mount type packaging is in turn driving the market progress.

• For instance, in November 2024, Micross Components, Inc. renovated the 70,000 sq. ft. state-of-the-art high reliability diode manufacturing facility. The facility consists of equipment such as Zener diodes in axial and surface-mount packages and others.

Thus, as per the market analysis, rising focus towards thermal management and reliability is driving the adoption of surface mount type packaging.

Hybrid Packaging is anticipated to register the fastest CAGR during the forecast period.

The combination of benefits from surface mount and through-hole technologies provide flexibility in design and functionality is driving the adoption of hybrid packaging segment. Additionally, the type of packing is majorly adopted in healthcare and aerospace & defense industries fueling the electronic packaging market size. Further, the ongoing development in smart packaging, IoT devices, and others is driving the need for materials which create flexible, integrated systems for diverse packaging applications.

Therefore, according to the electronic packaging market analysis, the rising adoption in healthcare and aerospace & defense industries is anticipated to boost the market during the forecast period.

By End-User Industry:

Based on the end user, the market is segmented into consumer electronics, automotive, aerospace & defense, healthcare, IT & telecom, and others.

Electronics packaging plays a vital role in various sectors including consumer electronics, automotive, aerospace & defense, healthcare, IT & telecom, and others. It provides mechanical support, thermal management, protection from environmental factors, and electrical insulation of electronic components used in the aforementioned industries. Moreover, advancement in electronics packaging technologies is crucial to support the growing complexity and high-performance requirements of modern electronic systems used in several industries.

Trends in the End User:

• The miniaturization of electronic components in consumer electronics sector is boosting the electronic packaging market trends.
• The trend towards growing demand for connected vehicles is driving the adoption of packaging solutions in automotive sector.

Consumer Electronics accounted for the largest revenue share in the year 2024.

The increasing penetration of consumer electronic devices such as smartphones, laptop and TV among others in emerging economies is paving the way for market adoption in consumer electronics sector. Additionally, growing adoption of IoT-enabled devices and smart home technologies is propelling the demand for cost effective packaging solutions, which in turn boost the electronic packaging market share. Further, the increasing focus towards protecting smartphones, laptops, and gaming consoles, and other electronic devices is fueling the electronic packaging market share.

• For instance, according to IBEF, India’s smartwatch shipments grew 50% YoY in FY23, due to the proliferation of low-cost devices and rising penetration of smartwatches.

Thus, as per the market analysis, growing adoption of IoT-enabled devices is driving the market adoption in consumer electronics sector.

Aerospace & Defense is anticipated to register the fastest CAGR during the forecast period.

The rising demand for high thermal and mechanical reliability for applications in aerospace & defence sectors is driving the market progress. Additionally, the ongoing advancement in the electronic components in aerospace such as avionics, radar systems, and satellite communication devices fuels the electronic packaging market size. Further, the rising adoption of the solution in aerospace & defence sector is due to durability and reliability in extreme environmental conditions.

Therefore, according to the electronic packaging market analysis, the rising adoption due to durability and reliability is anticipated to boost the market during the forecast period.